A low-pressure molding system is an innovative technology designed to overmold electronics quickly, safely, and in an eco-friendly manner. This reliable solution is ideal for encapsulating PCBs or electronic circuitry. The process is efficient, taking only 15 to 60 seconds, and uses environmentally friendly materials. The parameters of hot-melt low-pressure molding machines are straightforward to set and operate, making this system an increasingly popular alternative to traditional encapsulation processes.
Low-pressure overmolding is a manufacturing technique that uses low temperatures and pressures to mold components directly into a part. It's often used to protect electrical connectors, cables, and other delicate electronic equipment from moisture, dust, debris, vibration, and strain.
The low-pressure molding (LPM) process involves placing unprotected PCBs, cable assemblies, or other delicate electronic components into a precision mold. The mold cavity is then filled with low-pressure molding materials, such as polyamide or polyolefin (hot-melt resins). These materials effectively envelop the components, creating a sealed and protected product. The resulting encapsulated items are ready for immediate handling and testing.
The low-pressure injection molding process begins with heating thermoplastic materials, such as polyamide or polyurethane, into a molten state. The material is stored in a reservoir, ensuring consistent flow and temperature control to prevent degradation.
The molten material is injected into a pre-designed mold at low pressure. This ensures the material flows smoothly, filling all cavities without damaging delicate components like electronic circuits. The controlled pressure minimizes stress on the mold and the parts being encapsulated.
Once the mold is filled, the material is allowed to cool and solidify, forming the desired shape. After the material hardens, the mold is opened, and the finished product is ejected, ready for inspection or further assembly.
The Low-Pressure Injection Molding (LPM) process offers a superior alternative to traditional epoxy potting methods. It reduces cycle time, labor costs, material usage, and storage space, all while enabling a lightweight and compact design. Let’s compare LPM and epoxy potting based on the following key factors:
LPM materials are natural adhesives that are BPA-free, require no UV curing (eliminating potential risks like skin cancer), and are 100% recyclable. These features create a safer and more comfortable working environment for operators.
The LPM process significantly lowers costs associated with labor, storage, and materials. Additionally, its total cycle time is less than one-tenth of that required for epoxy potting, offering unmatched efficiency.
LPM provides superior performance with features such as waterproofing, insulation, temperature resistance, flame retardancy, vibration reduction, and excellent bonding to various materials. This process supports the creation of lightweight, compact product designs with higher production yields.
Low-pressure overmolding systems are widely used for creating waterproof solutions in electronic component design across various industries. These include medical devices, smart city applications, automotive sectors such as electric vehicles, and 5G technologies. These solutions are energy-efficient and fully automated, aligning perfectly with Industry 4.0 principles for lean and streamlined production.
